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tqp7m9103 1w high linearity amplifier dat a sheet: rev f 0 4/2 6 /12 - 1 of 14 - disclaimer: subject to change without notice ? 20 1 2 triquint semiconductor, inc. connecting the digital world to the glo bal network ? applications 3 - pin sot - 89 package ? repeaters ? bts transceivers ? bts high power amplifiers ? cdma / wcdma / lte ? general purpose wireless product features functional block diagram ? 400 - 4000 mhz ? +29 .5 dbm p1db ? + 45 dbm output ip3 ? 1 6 .5 db gain @ 2140 mhz ? +5v single supply, 2 3 5 ma current ? internal rf overdrive protection ? internal dc overvoltage protection ? on chip esd protection ? capable of handling 10:1 vswr @ 5vcc, 2.14 ghz, 29.5 dbm cw pout or 20 dbm wcdma pout ? so t - 89 package rf in gnd rf out gnd 1 2 3 4 general description pin configuration the tqp7m9103 is a high linearity driver amplifier in industry standard, rohs compliant , sot - 89 surface mount package. this ingap/gaas hbt delivers high performance across a broad ran ge of f requencies while achieving +4 5 dbm oip3 and +2 9 . 5 dbm p1db while only consuming 23 5 ma quiescent current. all devices are 100% rf and dc tested. the tqp7m9103 incorporates on - chip features that differentiate it from other products in the market. the amp lifier integrates an on - chip dc over - voltage and rf over - drive protection. this protects the amplifier from electrical dc voltage surges and high input rf input power levels that may occur in a system. the tqp7m9103 is targeted for use as a driver ampli fier in wireless infrastructure where high linearity, medium power, and high efficiency are required. th e device an excellent candidate for transceiver line cards and high power amplifiers in current and next generation multi - carrier 3g / 4g base stations. ordering i nfo rmation part no. description tqp7m9103 1 w high linearity amplifier tqp7m9103 - pcb 900 tqp7m9103 920 - 960m hz e vb tqp7m9103 - pcb2140 tqp7m9103 2.11 - 2.17g hz e vb standard t /r size = 1000 pieces on a 7 reel. pin # symbol 1 rf input 3 rf output / vcc 2, 4 ground
tqp7m9103 1w high linearity amplifier dat a sheet: rev f 0 4/2 6 /12 - 2 of 14 - disclaimer: subject to change without notice ? 20 1 2 triquint semiconductor, inc. connecting the digital world to the glo bal network ? specifications absolute maximum ratings parameter rating storage temperature - 65 to +150 o c device voltage, v cc + 8 v maximum input power , cw + 30 dbm operation of this device outside the parameter ranges given ab ove may cause permanent damage. recommended operating conditions parameter min typ max unit s v cc +5 + 5.25 v t case - 40 + 85 o c tj (for > 10 6 hours mttf ) + 1 7 0 o c electrical specifications are measured at specified test conditions. specifications a re not guaranteed over all recommended operating conditions. electrical specifications test conditions unless otherwise noted: +25 oc, + 5 v vsupply, 50 system , tuned application circuit parameter conditions min typical max unit s operational frequency range 400 4000 mhz test frequency 2140 mhz gain 14.7 16 .6 17.7 db input return loss 12 .0 db out put r eturn loss 1 5 .0 db output p1db + 28.5 +29 . 5 dbm output ip3 see note 1 . +42.5 + 4 5 db m wcdma pout @ - 50 dbc aclr see note 2 . + 20 dbm noise figure 4. 4 db v cc + 5 v quiescent current, i cq 210 23 5 260 ma thermal resistance (j nc to case) jc 35.6 o c/w notes 1. oip3 measured wi th two tones at an output power of + 15 dbm / tone separated by 1 mhz. the suppression on the largest im3 product is used to calculate the oip3 using 2:1 rule. 2. aclr test set - up: 3gpp wcdma, tm1+64 dpch, +5 mhz offset, par = 10.2 db at 0.01% prob.
tqp7m9103 1w high linearity amplifier dat a sheet: rev f 0 4/2 6 /12 - 3 of 14 - disclaimer: subject to change without notice ? 20 1 2 triquint semiconductor, inc. connecting the digital world to the glo bal network ? device characterization data 0 5 10 15 20 25 30 0 0.5 1 1.5 2 2.5 3 3.5 4 gain (db) frequency (ghz) gain and maximum stable gain gain (max) gain (s21) - 1 - 0.8 - 0.6 - 0.4 - 0.2 0 0.2 0.4 0.6 0.8 1 - 1 - 0.75 - 0.5 - 0.25 0 0.25 0.5 0.75 1 input smith chart 0.01 ghz 4 ghz output smith chart 0.01 ghz 4 ghz note: the gain for the unmatched device in 50 ohm syst em is shown as the trace in red color, [gain (s (21)]. for a tuned circuit for a particular frequency, it is expected that actual gain will be higher, up to the maximum st able gain. the maximum stable gain is shown in the black [gain ( max)]. the impedance plots are shown from 0.01 C 4 ghz . s - p arameter data v cc = +5 v, i cq = 235 ma, t = +25 c, unmatched 50 ohm system, calibrated to device leads freq (mhz) s11 ( db ) s11 (ang) s21 (db ) s21 (ang) s12 (db ) s12 (ang) s22 (db ) s22 (ang) 50 - 1.05 179.35 15.75 154.01 - 35.5 4 - 2.51 - 2.94 - 171.04 100 - 1.15 176.19 13.33 155.93 - 35.5 4 - 9.63 - 2.28 - 176.20 200 - 2.07 171.50 11.63 168.26 - 37.45 - 27.07 - 2.00 176.45 400 - 1.01 - 176.54 1 5.01 153.46 - 36.02 22.73 - 3.38 172.64 600 - 0.61 173.92 13.87 137.55 - 35.08 6.61 - 3.21 171.33 800 - 0.59 169.36 13.05 125.26 - 34.89 0.27 - 3.18 168.76 1000 - 0.62 164.62 12.35 114.05 - 34.56 - 4.24 - 3.13 166.33 1200 - 0.62 160.93 11.51 103.77 - 34.60 - 7.64 - 3. 21 164.22 1400 - 0.67 156.67 10.73 94.67 - 34.79 - 12.27 - 3.18 162.12 1600 - 0.64 153.26 10.00 86.25 - 34.75 - 15.00 - 3.21 159.50 1800 - 0.75 149.43 9.12 78.19 - 34.75 - 17.78 - 3.2 5 156.37 2000 - 0.64 145.77 8.50 70.63 - 34.8 1 - 20.08 - 3.09 154.32 2200 - 0.62 142. 62 7.90 63.72 - 34.51 - 23.77 - 3.24 151.96 2400 - 0.77 139.07 7.16 57.32 - 34.7 2 - 26.63 - 3.10 148.69 2600 - 0.66 135.41 6.58 51.13 - 34.60 - 29.04 - 3.07 147.12 2800 - 0.73 132.81 6.04 45.43 - 34.65 - 33.24 - 3.16 144.43 3000 - 0.69 128.99 5.51 39.41 - 34.51 - 33.49 - 3.09 141.32 3200 - 0.7 4 125.72 5.01 33.18 - 34.65 - 34.26 - 3.12 138.96 3400 - 0.74 122.13 4.52 27.44 - 34.60 - 37.56 - 3.09 136.12 3600 - 0.72 119.18 4.02 22.42 - 34.56 - 43.68 - 3.13 133.54 3800 - 0.77 116.00 3.52 16.74 - 34.37 - 44.96 - 3.04 130.91 4000 - 0.80 113 .01 3.15 11.74 - 34.33 - 46.26 - 2.96 128.69
tqp7m9103 1w high linearity amplifier dat a sheet: rev f 0 4/2 6 /12 - 4 of 14 - disclaimer: subject to change without notice ? 20 1 2 triquint semiconductor, inc. connecting the digital world to the glo bal network ? reference design 869 - 894 mhz j4 j3 u1 c7 l1 c2 c3 c4 c1 c6 l2 c5 r1 rf performance plots 869 - 894 mhz 18 19 20 21 22 860 870 880 890 900 gain (db) frequency (mhz) gain vs. frequency temp.=+25 c - 25 - 20 - 15 - 10 - 5 0 860 870 880 890 900 input return loss (db) frequency (mhz) input return loss vs. frequency temp.=+25 c - 25 - 20 - 15 - 10 - 5 0 860 870 880 890 900 output return loss (db) frequency (mhz) output return loss vs. frequency temp.=+25 c - 65 - 60 - 55 - 50 - 45 - 40 - 35 15 16 17 18 19 20 21 aclr (dbc) output power (dbm) aclr vs. output power vs. freq 869 mhz 880 mhz 894 mhz w - cdma 3gpp test model 1+64 dpch, par = 10.2 db @ 0.01% probability, 3.84 mhz bw 27 28 29 30 31 870 875 880 885 890 895 p1db (dbm) frequency (mhz) p1db vs. frequency 25 30 35 40 45 50 17 18 19 20 21 oip3 (dbm) total output power (dbm) oip3 vs. total output power vs. freq 869 mhz 880 mhz 894 mhz typical performance at +25 c (mhz) 869 880 894 gain db 20.8 20.8 20.8 input return loss db - 17.5 - 18.7 - 17.2 output return loss db - 14.3 - 14.4 - 14.5 output p1db dbm +29.2 +29.3 +29.4 output ip3 (+19 dbm/tone, ?f = 1 mhz) dbm +43.6 +42.9 +42.3 wcdma channel power (at - 50 dbc aclr) db 19.7 19.7 19.7 supply voltage, vcc v +5 quiescent collector current, icq ma 235 notes: 1. see pc board layout, page 11 for more information. 2. the recommended compone nt values are dependent upon the frequency of operation. 3. all components are of 0603 size unless stated on the schematic. 4. critical component placement locations: distance from u1 pin 1 pad (left edge) to r1 (right edge): 128 mils ( 5.7 o at 880 mhz) distanc e from r1 (left edge) to c6 (right edge): 205 mils ( 9.1 o at 880 mhz) distance from c6 (left edge) to c1 (right edge): 10 mils ( 0.5 o at 88 0 mhz) distance from u1 pin 3 pad (right edge) to l2 (left edge): 130 mils ( 5.8 o at 88 0 mhz) distance from l2 (right edge) to c7 (left edge): 60 mils ( 2.7 o at 88 0 mhz) u1 tqp7m9103 j4 gnd j3 +5v 1 2,4 3 c6 4.7 pf j1 rf input j2 rf output l1 33 nh l2 2.2 nh c2 100 pf c1 3.3 pf c5 1.0 uf c4 0.1 uf c7 4.7 pf c3 100 pf r1 0 ?
tqp7m9103 1w high linearity amplifier dat a sheet: rev f 0 4/2 6 /12 - 5 of 14 - disclaimer: subject to change without notice ? 20 1 2 triquint semiconductor, inc. connecting the digital world to the glo bal network ? notes: 1. see pc board layout, page 11 for more information. 2. components shown on the silkscreen but not on the schematic are not used. 3. the recommen ded component values are dependent upon the frequency of operation. 4. all components are of 0603 size unless stated on the schematic. 5. critical component placement locations: distance fro m u1 pin 1 pad (left edge) to r1 (right edge): 125 mils ( 5.8 o at 920 mh z) distance fro m r1 (left edge) to c6 (right edge): 169 mils ( 7.9 o at 920 mhz) distance from c6 (l eft edge) to c1 (right edge): 51 mils ( 2.4 o at 920 mhz) distance from u1 pin 3 pad (right edge) to l2 (left edge): 120 mils ( 5.6 o at 920 mhz) distance from l2 (ri ght edge) to c7 (left edge): 62 mils ( 2.9 o at 920 mhz) application circuit 92 0 - 960 mhz ( tqp7m9103 - pcb900) j4 j3 u1 c7 l1 c2 c3 c5 c1 c6 l2 c4 r1 u1 tqp7m9103 j4 gnd j3 +5v 1 2,4 3 c6 3.9 pf j1 rf input j2 rf output l1 33 nh 0805 l2 2.2 nh c2 100 pf c1 3.3 pf c5 1.0 uf c4 0.1 uf c7 4.7 pf c3 100 pf r1 0 ? bill of material ref des value description manuf . part number n/a n/a printed circuit board triquint 1080068 u1 n/a tqp7m9103 amplifier, sot - 89 pkg. triquint 1077953 c1 3.3 pf cap., chip, 0603, +/ - 0.1pf, 50v, accu - p avx 06035j3r3abstr c2, c3 100 pf cap., chip, 0603, 5%, 50v, npo/cog various c4 0.1 uf cap., chip, 0603, 10%, 16v, x7r various c5 1.0 uf cap., chip, 0603, 10%, 10v, x5r various c6 3.9 pf cap., chip, 0603, + / - 0.05pf, 50v, accu - p avx 06035j3r9abstr c7 4.7 pf cap., chip, 0603, +/ - 0.05pf, 50v, accu - p avx 06035j4r7abstr l1 33 nh inductor, 0805, 5%, coilcraft cs series coilcraft 0805cs - 330xjlb l2 2.2 nh inductor, 0603, +/ - 0.3 nh toko ll1608 - fsl2n2s r1 0 resi stor, chip, 0603, 5%, 1/16w various
tqp7m9103 1w high linearity amplifier dat a sheet: rev f 0 4/2 6 /12 - 6 of 14 - disclaimer: subject to change without notice ? 20 1 2 triquint semiconductor, inc. connecting the digital world to the glo bal network ? typical performance 920 - 960 mhz (tqp7m9103 - pcb900) notes: 1. aclr test set - up: 3gpp wcdma, tm1+64 dpch, +5 mhz offset, par = 10.2 db at 0.01% prob. rf performance plots 920 - 960 mhz (tqp7m9103 - pcb900) 17 18 19 20 21 22 920 930 940 950 960 gain (db) frequency (mhz) gain vs. frequency +85 c +25 c 40 c - 25 - 20 - 15 - 10 - 5 0 920 930 940 950 960 input return loss (db) frequency (mhz) input return loss vs. frequency +85 c +25 c 40 c - 25 - 20 - 15 - 10 - 5 0 920 930 940 950 960 output return loss (db) frequency (mhz) output return loss vs. frequency +85 c +25 c 40 c - 65 - 60 - 55 - 50 - 45 14 15 16 17 18 19 20 21 aclr (dbc) output power (dbm) aclr vs output power at +25oc 920 mhz 940 mhz 960 mhz - 65 - 60 - 55 - 50 - 45 14 15 16 17 18 19 20 21 aclr (dbc) output power (dbm) aclr vs output power at 940mhz - 40 c +25 c +85 c 25 30 35 40 45 50 15 16 17 18 19 20 21 oip3 (dbm) pout/tone (dbm) oip3 vs. pout/tone vs. freq. 920 mhz 940 mhz 960 mhz 27 28 29 30 31 920 930 940 950 960 p1db (dbm) frequency (mhz) p1db vs frequency over temperature - 40 c +25 c +85 c 25 30 35 40 45 50 15 16 17 18 19 20 21 oip3 (dbm) pout/tone (dbm) oip3 vs. pout/tone vs. temp. - 40 c +25 c +85 c 0 100 200 300 400 500 600 21 23 25 27 29 31 icc (ma) output power (dbm) icc vs. output power at 940 mhz frequency mhz 920 94 0 960 gain db 20.6 20.7 20. 8 input return loss db - 10.0 - 10.8 - 10.8 output return loss db - 19.4 - 20.4 - 22. 5 output p1db dbm +29.5 +29.4 +29.5 output ip3 (+ 19 dbm/tone , ? f = 1 mhz) dbm +4 6.7 +4 5.4 + 44.0 wcdma channel power (at - 50 dbc aclr) [1] db m +20 +20 +20 noise figure db 5.8 5.8 5.8 supply voltage, vcc v +5 quiescent collector current, icq ma 2 3 5
tqp7m9103 1w high linearity amplifier dat a sheet: rev f 0 4/2 6 /12 - 7 of 14 - disclaimer: subject to change without notice ? 20 1 2 triquint semiconductor, inc. connecting the digital world to the glo bal network ? reference design 1805 - 1880 mhz j4 j3 u1 c7 l1 c2 c3 c4 c6 c5 c1 r1 rf performance plots 1805 - 1880 mhz 0 5 10 15 20 1800 1810 1820 1830 1840 1850 1860 1870 1880 gain (db) frequency (mhz) gain vs. frequency temp.=+25 c - 25 - 20 - 15 - 10 - 5 0 1800 1810 1820 1830 1840 1850 1860 1870 1880 input return loss (db) frequency (mhz) input return loss vs. frequency temp.=+25 c - 25 - 20 - 15 - 10 - 5 0 1800 1810 1820 1830 1840 1850 1860 1870 1880 output return loss (db) frequency (mhz) output return loss vs. frequency temp.=+25 c - 65 - 60 - 55 - 50 - 45 - 40 16 17 18 19 20 21 22 aclr (dbc) output power (dbm) aclr vs. output power vs. freq w - cdma 3gpp test model 1+64 dpch, par = 10.2 db @ 0.01% probability, 3.84 mhz bw 1805 mhz 1840 mhz 1880 mhz 25 30 35 40 45 50 11 13 15 17 19 oip3 (dbm) pout/tone (dbm) oip3 vs. pout/tone over freq 1805 mhz 1840 mhz 1880 mhz 25 26 27 28 29 30 1800 1810 1820 1830 1840 1850 1860 1870 1880 p1db (dbm) frequency (mhz) p1db vs. frequency typical performance at +25 c (mhz) 1805 1850 1880 gain db 17.7 17.7 17.7 input return loss db - 11.6 - 12.3 - 1 2.1 output return loss db - 16.1 - 16.3 - 16.6 output p1db dbm +29.5 +29.6 +29.5 output ip3 (+16 dbm /tone, ?f = 1 mhz) dbm +44.1 +43.8 +43.2 wcdma channel power (at - 50 dbc aclr) db +20.0 +20.2 +20.2 supply voltage, vcc v +5 quiescent collector current, icq ma 235 notes: 1. see pc board layout, page 11 for more information. 2. all components are of 0603 size unless otherwise stated. 3. component (r 1 ) on pcb board is a 0 ohm jumper and can be replaced by a copper trace. 4. cr itical component placement locations : distance from u1 pin 1 pad (left edge) to c6 (right edge): 45 mils (4. 2 o at 185 0 mhz) distance from c6 (left edge) to c1 (right edge): 20 mils ( 1.9 o at 185 0 mhz) distance from u1 pin 3 pad (right edge) to c7 (left ed ge): 185 mils ( 17.3 o at 185 0 mhz) u1 tqp7m9103 j4 gnd j3 +5v 1 2,4 3 c6 2.4 pf j1 rf input j2 rf output l1 12 nh c2 68 pf c1 2.7 pf c5 1.0 uf c4 0.1 uf c7 1.8 pf c3 22 pf
tqp7m9103 1w high linearity amplifier dat a sheet: rev f 0 4/2 6 /12 - 8 of 14 - disclaimer: subject to change without notice ? 20 1 2 triquint semiconductor, inc. connecting the digital world to the glo bal network ? reference design 1930 - 19 60 mhz j4 j3 u1 c6 l1 c2 c3 c5 c4 c1 r1 rf performance plots 1930 - 1990 mhz 13 14 15 16 17 18 1930 1940 1950 1960 1970 1980 1990 gain (db) frequency (mhz) gain vs. frequency temp.=+25 c - 25 - 20 - 15 - 10 - 5 0 1930 1940 1950 1960 1970 1980 1990 input return loss (db) frequency (mhz) input return loss vs. frequency temp.=+25 c - 25 - 20 - 15 - 10 - 5 0 1930 1940 1950 1960 1970 1980 1990 output return loss (db) frequency (mhz) output return loss vs. frequency temp.=+25 c - 65 - 60 - 55 - 50 - 45 12 14 16 18 20 aclr (dbc) output power (dbm) alcr vs output power over freq w - cdma 3gpp test model 1+64 dpch, par = 10.2 db @ 0.01% probability, 3.84 mhz bw 1930 mhz 1960 mhz 1990 mhz 25 30 35 40 45 50 12 13 14 15 16 17 18 oip3 (dbm) pout/tone (dbm) oip3 vs. pout/tone over freq temp.=+25 c 1930 mhz 1960 mhz 1990 mhz 25 26 27 28 29 30 1930 1940 1950 1960 1970 1980 1990 p1db (dbm) frequency (mhz) p1db vs. frequency typical performance at +25 c (mhz) 1930 1960 1990 gain db 17.0 17.0 16.9 input return loss db - 15.2 - 17.8 - 18.3 output return loss db - 13.0 - 12.9 - 12.8 output p1db db m +29.3 +29.3 +29.3 output ip3 (+16 dbm/tone, ?f = 1 mhz) dbm +44.0 +45 .2 +44.2 wcdma channel power (at - 50 dbc aclr) [1] db +20.0 +20.0 +20.0 supply voltage, vcc v +5 quiescent collector current, icq ma 235 notes: 1. see pc board layout, page 11 for more information. 2. the recommended component values are dependent upon the frequency of operation. 3. component (r1) on pcb board is a 0 ohm jumper and can be replaced by a copper trac e. 4. all components are of 0603 size unless stated on the schematic. 5. critical component placement locations: distance from u1 pin 1 pad ( left edge) to c5 (right edge): 55 mils ( 5. 5 o at 1960 mhz) distance from c5 (left edge) to c1 (right edge): 10 mils ( 1.0 o at 1960 mhz) distance from u1 pin 3 pad (right edge) to c6 (left edge): 125 mils ( 12. 4 o at 1960 mhz) u1 tqp7m9103 j4 gnd j3 +5v 1 2,4 3 c5 2.0 pf j1 rf input j2 rf output l1 22 nh c2 22 pf c1 1.5 pf c4 1.0 uf c6 1.5 pf c3 22 pf
tqp7m9103 1w high linearity amplifier dat a sheet: rev f 0 4/2 6 /12 - 9 of 14 - disclaimer: subject to change without notice ? 20 1 2 triquint semiconductor, inc. connecting the digital world to the glo bal network ? notes: 1. see pc board layout, page 11 for more information. 2. components shown on the silkscreen but not on the schematic are not used. 3. component (r1) is a 0 resistors may be replaced with copper trace in the target ap plication layout. 4. the recommended component values are dependent upon the frequency of operation. 5. all components are of 0603 size unless stated on the schematic. 6. critical component placement locations: distance from u1 pin 1 pad (left edge) to c6 (right e dge): 28 mils ( 3.0 o at 2140 mhz) distance from c6 (le ft edge) to c1 (right edge): 65 mils ( 7.0 o at 2140 mhz) distance from u1 pin 3 pad (right edge) to c7 (left edge): 31 mils ( 3.4 o at 2140 mhz) distance from c7 (right edge) to r2 (left edge): 60 mils ( 6. 5 o at 2140 mhz) distance from r2 (right edge) to c8 (left edge): 62 mils ( 6. 7 at 2140 mhz) application circuit 2110 - 2170 mhz ( tqp7m9103 - pcb214 0) j4 j3 u1 c7 l1 c2 c3 c4 c1 r1 c6 c5 c8 r2 u1 tqp7m9103 j4 gnd j3 vcc 1 2,4 3 c6 1.5 pf j1 rf input j2 rf output l1 33 nh 0805 c2 22 pf c5 1.0 uf c4 0.1 uf c8 0.6 pf c3 22 pf c7 1.2 pf c1 1.5 pf r2 0 ? bill of material ref des value description manuf . part number n/a n/a printed circuit board triquint 1080068 u1 n/a tqp7m9103 amplifier, sot - 89 p kg. triquint tqp7m9103 c1, c6 1.5 pf cap., chip, 0603, +/ - 0.05pf, 50v, accu - p avx 06032u1r5bat2a c2, c3 22 pf cap., chip, 0603, 5%, 50v, npo/cog various c4 0.1 uf cap., chip, 0603, 10%, 16v, x7r various c5 1.0 uf cap., chip, 0603, 10%, 10v, x5r vario us c7 1.2 pf cap., chip, 0603, +/ - 0.05pf, 50v, accu - p avx 06035j1r2abstr c8 0.6 pf cap., chip, 0603, +/ - 0.05pf, 50v, accu - p avx 06035j0r6abstr r1 , r2 0 resistor, chip, 0603, 5%, 1/16w various l1 33 nh inductor, 0805, 5%, coilcraft cs series coilcra ft 0805cs - 330xjlb
tqp7m9103 1w high linearity amplifier dat a sheet: rev f 0 4/2 6 /12 - 10 of 14 disclaimer: subject to change without notice ? 20 1 2 triquint semiconductor, inc. connecting the digital world to the glo bal network ? typical performance 2110 - 2170 mhz (tqp7m9103 - pcb2140) notes: 1. a clr test set - up: 3gpp wcdma, tm1+64 dpch, +5 mhz offset, par = 10.2 db at 0.01% prob. rf performance plots 2110- 2170 mhz (tqp7m9103 - pcb2140) 13 14 15 16 17 18 2110 2120 2130 2140 2150 2160 2170 gain (db) frequency (mhz) gain vs. frequency +85 c +25 c 40 c - 25 - 20 - 15 - 10 - 5 0 2110 2120 2130 2140 2150 2160 2170 input return loss (db) frequency (mhz) input return loss vs. frequency +85 c +25 c 40 c - 25 - 20 - 15 - 10 - 5 0 2110 2120 2130 2140 2150 2160 2170 output return loss (db) frequency (mhz) output return loss vs. frequency +85 c +25 c 40 c - 65 - 60 - 55 - 50 - 45 13 14 15 16 17 18 19 20 aclr (dbc) output power (dbm) aclr vs output power at +25oc 2110 mhz 2140 mhz 2170 mhz - 65 - 60 - 55 - 50 - 45 13 14 15 16 17 18 19 20 aclr (dbc) output power (dbm) aclr vs output power at 2.14ghz +85 c +25 c - 40 c 25 30 35 40 45 50 12 13 14 15 16 17 18 oip3 (dbm) pout/tone (dbm) oip3 vs. pout/tone vs. freq. 2110 mhz 2140 mhz 2170 mhz 25 30 35 40 45 50 12 13 14 15 16 17 18 oip3 (dbm) pout/tone (dbm) oip3 vs. pout/tone vs. temp. - 40 c +25 c +85 c 27 28 29 30 31 2110 2120 2130 2140 2150 2160 2170 p1db (dbm) frequency (mhz) p1db vs frequency over temperature +85 c +25 c - 40 c 0 100 200 300 400 500 600 22 24 26 28 30 32 icc (ma) output power (dbm) icc vs. output power at 2140 mhz frequency mhz 2110 2140 2170 gain db 16.7 16.6 16.6 input return loss db - 11.7 - 12.0 - 11.7 output return loss db - 1 6.5 - 1 6.0 - 15.2 outp ut p1db dbm +29. 5 +29. 5 +29. 6 output ip3 (+ 15 dbm/tone , ? f = 1 mhz ) dbm +4 5 . 0 +4 5 .0 +45. 0 wcdma channel power (at - 50 dbc aclr) [1] db m +20 +20 +20 noise figure db 4.4 4.4 4.6 supply voltage, vcc v + 5 quiescent collector current, icq ma 23 5
tqp7m9103 1w high linearity amplifier dat a sheet: rev f 0 4/2 6 /12 - 11 of 14 disclaimer: subject to change without notice ? 20 1 2 triquint semiconductor, inc. connecting the digital world to the glo bal network ? reference design 2300- 2400 mhz j4 j3 u1 c7 l1 c2 c3 c4 c1 c6 c5 c8 r1 rf performance plots 2300 - 2400 mhz 12 13 14 15 16 17 2300 2320 2340 2360 2380 2400 gain (db) frequency (mhz) gain vs. frequency temp.=+25 c - 25 - 20 - 15 - 10 - 5 0 2300 2320 2340 2360 2380 2400 input return loss (db) frequency (mhz) input return loss vs. frequency temp.=+25 c - 25 - 20 - 15 - 10 - 5 0 2300 2320 2340 2360 2380 2400 output return loss (db) frequency (mhz) output return loss vs. frequency temp.=+25 c - 60 - 55 - 50 - 45 - 40 - 35 17 18 19 20 21 22 aclr (dbc) output power (dbm) aclr vs. output power vs. freq 2300 mhz 2350 mhz 2400 mhz w - cdma 3gpp test model 1+64 dpch, par = 10.2 db @ 0.01% probability, 3.84 mhz bw 27 28 29 30 31 2300 2320 2340 2360 2380 2400 p1db (dbm) frequency (mhz) p1db vs. frequency 25 30 35 40 45 50 12 14 16 18 20 oip3 (dbm) total output power (dbm) oip3 vs. total output power vs. freq 2300 mhz 2350 mhz 2400 mhz typical performance at +25 c (mhz) 2300 2350 2400 gain db 16.1 16.1 15.9 input return loss db - 13.7 - 15.7 - 14.0 output return loss db - 15.4 - 14.8 - 14.0 output p1db dbm +29.2 +29.2 +29.3 output ip3 (+15 dbm /tone, ?f = 1 mhz) dbm +45.6 +44.2 +45.2 wcdma channel power (at - 50 dbc aclr) [1] db +20.0 +19.9 +19.9 supply voltage, vcc v +5 quiescent collector current, icq ma 235 notes: 1. see pc board layout, page 11 for more information. 2. the recommended component values are dependent upon the frequency of operation. 3. component (r1) on pcb board is a 0 ohm jumper and can be replaced by a copper trace. 4. al l components are of 0603 size unless stated on the schematic. 5. critical component placement locations: distance from u1 pin 1 pad ( left edge) to c6 (right edge): 30 mils ( 3.6 o at 2 350 mhz) distance from c6 (left edge) to c1 (right edge): 75 mils ( 8.9 o at 2 3 50 mhz) distance from u1 pin 3 pad (right edge) to c7 (left edge): 30 mils ( 3.6 o at 2 350 mhz) distance from c7 (r ight edge) to c8 (left edge): 14 7 mils ( 17.5 o at 2 350 mhz) u1 tqp7m9103 j4 gnd j3 +5v 1 2,4 3 c6 1.2 pf j1 rf input j2 rf output l1 24 nh c2 22 pf c1 1.0 pf c5 1.0 uf c4 0.1 uf c8 0.6 pf c3 100 pf c7 1.0 pf
tqp7m9103 1w high linearity amplifier dat a sheet: rev f 0 4/2 6 /12 - 12 of 14 disclaimer: subject to change without notice ? 20 1 2 triquint semiconductor, inc. connecting the digital world to the glo bal network ? pin configuration and description rf in gnd rf out gnd 1 2 3 4 pin symbol description 1 rf in rf input . requires external match for optimal performance. external dc block required. 2, 4 gnd rf/dc ground connection 3 rfout / vcc rf output . requires external match for optimal performance . exte rnal dc block and supply voltage is required . applications information pc board layout pcb material (stackup): 1 oz. cu top layer 0.014 inch nelco n - 4000 - 13 , r =3.7 1 oz. cu middle layer 1 core nelco n - 4000 - 13 1 oz. cu middle layer 2 0.014 inch nelco n - 4000 - 13 1 oz. cu bottom layer f inished board thickness is 0 .062.00 6 50 ohm line dimensions : width = .0 28 , spacing = .0 28 . the pad pattern shown has been d eveloped and tested for optimized assembly at triquint semiconductor. the pcb land pattern has been developed to accommodate lead and p ackage tolerances. since sur face mount processes vary from supplier to supplier , careful process development is recomme nded.
tqp7m9103 1w high linearity amplifier dat a sheet: rev f 0 4/2 6 /12 - 13 of 14 disclaimer: subject to change without notice ? 20 1 2 triquint semiconductor, inc. connecting the digital world to the glo bal network ? mechanical information package information and dimensions this package is lead - free/rohs - compliant. the plating materia l on the leads is nipdau. it is compatible with both lead - free (maximum 260 c reflow temperature) and lead (maximum 245 c reflow temperature) soldering processes. the compon ent will be marked with a 7m9103 designator with an alphanumeric lot code on the top surface of package. mounting configuration all dimensions are in millimeters (inches). angles are in degrees. notes : 1. ground / thermal vias are critical for the proper performance of this device. vias should use a .35mm (#80 / .0135) diamete r drill and have a final plated thru diameter of .25 mm (.010). 2. add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. rf trace width depends upon the pc board material and construction. 4. use 1 oz. copper minimum. 7m9103
tqp7m9103 1w high linearity amplifier dat a sheet: rev f 0 4/2 6 /12 - 14 of 14 disclaimer: subject to change without notice ? 20 1 2 triquint semiconductor, inc. connecting the digital world to the glo bal network ? product compliance information esd information esd rating: class 2 value: 2000 v and < 4000 v test: human body model (hbm) standard: jedec standard jesd22 - a114 esd rating: class iv value: 200 0 v min test: charged device model (cdm) standard: jedec standard jesd22 - c101 solderability compatible with the latest version of j - std - 020, lead free solder, 260 this part is compliant with eu 2002/95/ec rohs directive (restrictions on the use of certain hazardous substances in electrical and electronic equipment). this product also has the following attributes: ? lead free ? ha logen free (chlorine, bromine) ? antimony free ? tbbp - a (c 15 h 12 br 4 0 2 ) free ? pfos free ? svhc free msl rating level 3 at +260 c convection reflow the part is rated moisture sensitivity level 3 at 260c per jedec standard ipc/jedec j - std - 020. contact informat ion for the latest specifications, additional product information, worldwide sales and distribution locations, and information ab out triquint: web: www.triquint.com tel: +1.503.615.9000 email: info - sales@tqs.com fax: +1.503.615.8902 for technical questions and application information: email: sjcapplications.engineering@tqs.com important notice the informa tion contained herein is believed to be reliable . triquint makes no warranties regarding the information contain ed herein . triquint assumes no responsibility or liability whatsoever for any of the information contained her ein. triquint assumes no respon sibility or liability whatsoever for the use of the information contained herein. the information contained herein is provided "as is, where is" and with all faults, and the entire risk associated with such information is entirely with the user. all info rmation contained herein is subject to change without notice. customers should obtain and verify the latest relevant information before placing orders for triquint products. the information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by such information. triquint products are not warranted or authorized for use as critical components in medical, life - saving, or life - sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death.

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